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News

09/12 09:00 EST - prnewswire.com
Simpson Manufacturing Co., Inc. Announces Participation at The D.A. Davidson 23rd Annual Diversified Industrials & Services Conference
PLEASANTON, Calif. , Sept. 12, 2024 /PRNewswire/ -- Simpson Manufacturing Co., Inc. (the "Company") (NYSE: SSD), an industry leader in engineered structural connectors and building solutions, today announced that Mike Olosky, President and Chief Executive Officer and Simpson management will participate in D.A.

09/03 16:15 EST - prnewswire.com
Simpson Manufacturing Co. Celebrates 30 Years as a Public Company with Ringing of the Closing Bell at the NYSE on September 6th
PLEASANTON, Calif. , Sept. 3, 2024 /PRNewswire/ -- Simpson Manufacturing Co., Inc. (the "Company") (NYSE: SSD), an industry leader in engineered structural connectors and building solutions, today announced that Mike Olosky, President and Chief Executive Officer, will ring the closing bell at the New York Stock Exchange (NYSE) on Friday, September 6, 2024, in celebration of the Company's 30th anniversary as a publicly listed company.

08/28 09:00 EST - prnewswire.com
SIMPSON MANUFACTURING CO., INC. ANNOUNCES PARTICIPATION AT THE 2024 JEFFERIES INDUSTRIALS CONFERENCE
PLEASANTON, Calif. , Aug. 28, 2024 /PRNewswire/ -- Simpson Manufacturing Co., Inc. (the "Company") (NYSE: SSD), an industry leader in engineered structural connectors and building solutions, today announced that Mike Olosky, President and Chief Executive Officer and Simpson management will participate in the upcoming 2024 Jefferies Industrials Conference on Wednesday, September 4, 2024.

08/05 09:03 EST - globenewswire.com
Micron Develops Industry's First PCIe Gen6 Data Center SSD for Ecosystem Enablement
Micron's FMS 2024 presence highlights its AI product leadership in memory and storage from the data center to edge devices Micron's FMS 2024 presence highlights its AI product leadership in memory and storage from the data center to edge devices

08/05 09:00 EST - prnewswire.com
Silicon Motion Launches the Best Performance/Watt PCIe Gen5 SSD Controller at FMS 2024
The Company Also Showcases SSD Solutions for Enterprise, PC, and Automotive AI Applications TAIPEI and MILPITAS, Calif. , Aug. 5, 2024 /PRNewswire/ -- Silicon Motion Technology Corporation (NasdaqGS: SIMO) ("Silicon Motion"), a global leader in designing and marketing NAND flash controllers for solid-state storage devices, today announced SM2508 , the best power efficiency PCIe Gen5 NVMe 2.0 client SSD controller for AI PCs and gaming consoles.

08/05 08:02 EST - globenewswire.com
Microchip Introduces High-Performance PCIe® Gen 5 SSD Controller Family
CHANDLER, Ariz., Aug. 05, 2024 (GLOBE NEWSWIRE) -- The Artificial Intelligence (AI) boom and rapid expansion of cloud-based services are accelerating the need for data centers to be more powerful, efficient and highly reliable.

07/31 16:15 EST - prnewswire.com
Simpson Manufacturing Co. Announces Retirement of Chief Financial Officer and Treasurer, Brian Magstadt
PLEASANTON, Calif. , July 31, 2024 /PRNewswire/ -- Simpson Manufacturing Co., Inc. (the "Company") (NYSE: SSD), an industry leader in engineered structural connectors and building solutions, today announced that Brian Magstadt, Chief Financial Officer and Treasurer, has informed the Company of his intention to retire effective December 31, 2024.

07/30 09:03 EST - globenewswire.com
Micron Announces Volume Production of Ninth-Generation NAND Flash Technology
Industry-leading Micron 2650 NVMe SSD, based on ninth-generation NAND, begins volume shipment Industry-leading Micron 2650 NVMe SSD, based on ninth-generation NAND, begins volume shipment

07/29 09:00 EST - prnewswire.com
Simpson Manufacturing Co., Inc. Declares Quarterly Dividend
PLEASANTON, Calif. , July 29, 2024 /PRNewswire/ -- Simpson Manufacturing Co., Inc. (the "Company") (NYSE: SSD), an industry leader in engineered structural connectors and building solutions, today announced that on July 26, 2024, the Company's Board of Directors (the "Board") declared a regular quarterly dividend of 28 cents per share on the Company's common stock.

07/23 09:01 EST - globenewswire.com
Micron Introduces the World's Fastest Data Center SSD
Innovative Micron 9550 PCIe Gen5 SSD delivers unrivaled workload performance for AI and beyond Innovative Micron 9550 PCIe Gen5 SSD delivers unrivaled workload performance for AI and beyond

07/22 18:54 EST - seekingalpha.com
Simpson Manufacturing Co., Inc. (SSD) Q2 2024 Earnings Call Transcript
Simpson Manufacturing Co., Inc. (NYSE:SSD ) Q2 2024 Earnings Conference Call July 22, 2024 5:00 PM ET Company Participants Kim Orlando - IR, ADDO Investor Relations Mike Olosky - President & CEO Brian Magstadt - CFO Conference Call Participants Daniel Moore - CJS Securities Tim Wojs - Baird Kurt Yinger - D.A. Davidson Operator Greetings and welcome to the Simpson Manufacturing Company's Second Quarter 2024 Earnings Conference Call.

07/22 16:15 EST - prnewswire.com
SIMPSON MANUFACTURING CO., INC. ANNOUNCES 2024 SECOND QUARTER FINANCIAL RESULTS
PLEASANTON, Calif. , July 22, 2024 /PRNewswire/ --  Net sales of $597.0 million Income from operations of $132.2 million, resulting in operating income margin of 22.1% Net income per diluted share of $2.31 Repurchased $50.0 million of common stock during the quarter Simpson Manufacturing Co., Inc. (the "Company") (NYSE: SSD), an industry leader in engineered structural connectors and building solutions, today announced its financial results for the second quarter of 2024.

07/17 09:00 EST - globenewswire.com
Micron Unveils Industry's Fastest 2230 Gen4 Consumer SSD, the Crucial P310, to Accelerate Handheld Gaming, Ultrathin Laptops and Mini PCs
Offering up to 2TB of storage, the P310 2230 SSD empowers handheld gamers to expand gaming libraries while increasing performance and load speed Offering up to 2TB of storage, the P310 2230 SSD empowers handheld gamers to expand gaming libraries while increasing performance and load speed

07/08 09:00 EST - prnewswire.com
Simpson Manufacturing Co., Inc. to Announce Second Quarter 2024 Financial Results on Monday, July 22nd
PLEASANTON, Calif. , July 8, 2024 /PRNewswire/ -- Simpson Manufacturing Co., Inc. (the "Company") (NYSE: SSD), an industry leader in engineered structural connectors and building solutions, announced today that it will report its financial results for the second quarter ended June 30, 2024 on Monday, July 22, 2024 at 4:15 p.m.

06/28 18:55 EST - seekingalpha.com
5 Upcoming Dividend Increases Including A King
This week's increases include Dividend King Sysco Corporation with a 2% increase, extending its 54-year streak. The tables and lists are generated using data from the U.S. Dividend Champions spreadsheet and NASDAQ. I review some companies closer as part of my review process for including them in my own personal portfolio.

06/17 16:05 EST - prnewswire.com
Simpson Manufacturing Co., Inc. Publishes Fiscal 2023 Corporate Social Responsibility Report
PLEASANTON, Calif., June 17, 2024 /PRNewswire/ -- Simpson Manufacturing Co., Inc. (the "Company") (NYSE: SSD), an industry leader in engineered structural connectors and building solutions, announced today it has published its Fiscal 2023 Corporate Social Responsibility Report.

06/05 09:00 EST - prnewswire.com
SIMPSON MANUFACTURING CO., INC. ANNOUNCES PARTICIPATION AT THE 2024 WELLS FARGO INDUSTRIALS CONFERENCE
PLEASANTON, Calif. , June 5, 2024 /PRNewswire/ -- Simpson Manufacturing Co., Inc. (the "Company") (NYSE: SSD), an industry leader in engineered structural connectors and building solutions, today announced that Brian Magstadt, Chief Financial Officer and Treasurer, will participate in the upcoming 2024 Wells Fargo Industrials Conference on Wednesday, June 12, 2024, at The Loews Chicago in Chicago, Illinois.

05/20 16:30 EST - prnewswire.com
SIMPSON MANUFACTURING CO., INC. ANNOUNCES UDIT MEHTA AS CHIEF TECHNOLOGY OFFICER
PLEASANTON, Calif. , May 20, 2024 /PRNewswire/ -- Simpson Manufacturing Co., Inc. (the "Company") (NYSE: SSD), an industry leader in engineered structural connectors and building solutions, today announced Udit Mehta has joined the Company as Chief Technology Officer, effective May 10, 2024.

05/20 04:00 EST - https://www.prnewswire.com
Compact Solutions, Mighty Results: Cervoz Unleashes the Power of Edge Computing
TAIPEI, May 20, 2024 /PRNewswire/ -- Cervoz Technology, a leader in industrial-grade storage, memory, and expansion solutions, is powering the evolution of edge computing with its innovative solutions. In today's data-rich landscape, businesses rely on insights from IoT devices. With advancements in AI and 5G, data volumes surge, straining traditional cloud computing with bandwidth and latency issues. Edge Computing emerges as a solution, processing data at its source for real-time insights crucial for applications like digital twins, autonomous vehicles, and smart healthcare. What is Edge Computing? Edge Computing is a decentralized IT architecture that processes data near its origin, often at the network's edge. This approach divides tasks from central data centers to edge devices and nodes. It enables faster, deeper insights and enhances responsiveness, improving speed and reducing latency compared to centralized clouds. Typically, an Edge Computing system comprises three layers: device, edge, and cloud. The Device Layer The device layer, situated closest to the physical world, comprises endpoint devices such as sensors, controllers, and cameras, among others. The layer prioritizes data collection and initial processing for real-time response and efficiency. It requires highly reliable, compact, and energy-efficient components. Cervoz's M.2 2230 (A+E key /B+M key) NVMe SSDs and DDR4 SO-DIMM modules optimize this setup with fast data access and efficient storage in space-saving designs. They operate reliably across a wide temperature range (-40°C to 85°C) and feature additional conformal coating and anti-vibration filling for enhanced performance in harsh environments. The Edge Layer The edge layer, composed of edge servers and gateways, serves as a crucial link between device-layer data sources and cloud-based operations. It is designed for extensive data handling, filtering, and analytics, emphasizing quick operations and real-time responses to minimize reliance on remote data centers. For optimal performance, components must manage high processing loads with minimal latency and maximum stability. NVMe SSDs boasting PCIe Gen3 or higher, such as the Cervoz NVMe PCIe Gen3x4 SSD, with compact M.2 form factors, advanced DRAM cache buffer, and LDPC ECC technology, are perfectly suited for the edge layer. These SSDs enable efficient directory and error correction during high-speed data transfers, thus enhancing data accuracy and reliability. The Cloud Layer The cloud layer requires intensive processing and long-term storage, performing analytics, operating AI and machine learning, and managing extensive data systems across various edge locations. It demands high-performing and reliable components. Cervoz NVMe PCIe Gen4x4 SSDs excel with Read/Write speeds of up to 7,100/6,190 MB/s and 4K random IOPS up to 1,000K, with aluminum heatsinks and thermal throttling for overheating issues. DDR5-5600 DRAM boosts this setup with high data throughput and efficient power use, satisfying rigorous computational needs. Interlayer Connectivity Reliable, low-latency network connectivity is crucial as data flows between the device layer, edge, and cloud. Cervoz 10GbE Low-Profile Ethernet Card provides high-speed, stable wired connections in high-bandwidth, low-latency environments. Additionally, the new PCIe Compact Low-Profile Ethernet Card is ideal for narrow edge device enclosures. For areas where wiring is impractical, M.2 Wi-Fi cards offer essential wireless flexibility. These connectivity options ensure a solid foundation for seamless data management across all layers. Cervoz offers comprehensive solutions to enhance edge computing capabilities. From compact NVMe SSDs and DRAM modules, to advanced modular expansion cards, enabling seamless integration, optimized performance, and unmatched reliability in edge computing deployments. About Cervoz Based in Taiwan, Cervoz Technology boasts almost twenty years of expertise in developing and providing industrial-grade storage, memory, and expansion solutions across a myriad of global industrial sectors. ContactsSales: [email protected] Photo - https://mma.prnewswire.com/media/2414604/2024_05_PR_Compact_Solution_1920x1080.jpg

05/20 03:00 EST - https://www.prnewswire.com
Soluciones compactas, resultados fantásticos: Cervoz desata el poder de la computación perimetral
TAIPEI, 20 de mayo de 2024 /PRNewswire/ -- Cervoz Technology, líder en soluciones de expansión, memoria y almacenamiento de nivel industrial, está impulsando la evolución de la informática edge con sus soluciones innovadoras. En el panorama actual rico en datos, las empresas dependen de la información obtenida de los dispositivos IoT. Con los avances en IA y 5G, los volúmenes de datos aumentan, lo que pone a prueba la computación en la nube tradicional con problemas de ancho de banda y latencia. Edge Computing surge como una solución que procesa datos en su origen para obtener información en tiempo real crucial para aplicaciones como gemelos digitales, vehículos autónomos y atención médica inteligente. ¿Qué es la computación edge? Edge Computing es una arquitectura de TI descentralizada que procesa datos cerca de su origen, a menudo en el borde de la red. Este enfoque divide las tareas de los centros de datos centrales a los dispositivos y nodos de borde. Permite obtener conocimientos más rápidos y profundos y mejora la capacidad de respuesta, mejorando la velocidad y reduciendo la latencia en comparación con las nubes centralizadas. Normalmente, un sistema Edge Computing consta de tres capas: dispositivo, borde y nube. La capa del dispositivo La capa de dispositivo, situada más cerca del mundo físico, comprende dispositivos terminales como sensores, controladores y cámaras, entre otros. La capa prioriza la recopilación de datos y el procesamiento inicial para lograr una respuesta y eficiencia en tiempo real. Requiere componentes altamente fiables, compactos y energéticamente eficientes. Los M.2 2230 (A+E key /B+M key) NVMe SSDs y los módulos DDR4 SO-DIMM de Cervoz optimizan esta configuración con acceso rápido a datos y almacenamiento eficiente en diseños que ahorran espacio. Operan de manera confiable en un amplio rango de temperatura (de -40 °C a 85 °C) y cuentan con un revestimiento conformal adicional y un relleno anti-vibración para mejorar el rendimiento en entornos hostiles. La capa del borde La capa del borde, compuesta por servidores perimetrales y puertas de enlace, sirve como vínculo crucial entre las fuentes de datos de la capa de dispositivo y las operaciones basadas en la nube. Está diseñado para un amplio manejo, filtrado y análisis de datos, enfatizando operaciones rápidas y respuestas en tiempo real para minimizar la dependencia de centros de datos remotos. Para un rendimiento óptimo, los componentes deben gestionar altas cargas de procesamiento con una latencia mínima y una estabilidad máxima. Los SSD NVMe con PCIe Gen3 o superior, como el Cervoz NVMe PCIe Gen3x4 SSD, con factores de forma M.2 compactos, DRAM cache buffer avanzado y tecnología LDPC ECC, son perfectamente adecuados para la capa del borde. Estos SSD permiten una corrección eficiente de directorios y errores durante las transferencias de datos de alta velocidad, mejorando así la precisión y fiabilidad de los datos. La capa de la nube La capa de nube requiere un procesamiento intensivo y almacenamiento a largo plazo, realizar análisis, operar inteligencia artificial y aprendizaje automático, y administrar extensos sistemas de datos en varias ubicaciones de borde. Exige componentes confiables y de alto rendimiento. Los Cervoz NVMe PCIe Gen4x4 SSDs destacan con velocidades de lectura/escritura de hasta 7100/6190 MB/s y 4K IOPS aleatorios de hasta 1.000K, con disipadores de calor de aluminio y regulación térmica para problemas de sobrecalentamiento. DDR5-5600 DRAM mejora esta configuración con un alto rendimiento de datos y un uso eficiente de la energía, satisfaciendo rigurosas necesidades computacionales. Conectividad entre capas La conectividad de red fiable y de baja latencia es crucial a medida que los datos fluyen entre la capa del dispositivo, el borde y la nube. La 10GbE Low-Profile Ethernet Card Cervoz proporciona conexiones por cable estables y de alta velocidad en entornos de gran ancho de banda y baja latencia. Además, la nueva PCIe Compact Low-Profile Ethernet Card es ideal para gabinetes de dispositivos de borde estrecho. Para áreas donde el cableado no es práctico, las tarjetas M.2 Wi-Fi ofrecen una flexibilidad inalámbrica esencial. Estas opciones de conectividad garantizan una base sólida para una gestión de datos perfecta en todas las capas. Cervoz ofrece soluciones integrales para mejorar las capacidades informáticas de vanguardia. Desde NVMe SSDs compactos y módulos DRAM hasta tarjetas de expansión modulares avanzadas, que permiten una integración perfecta, un rendimiento optimizado y una fiabilidad inigualable en implementaciones informáticas de vanguardia. Acerca de Cervoz Con sede en Taiwán, Cervoz Technology cuenta con casi veinte años de experiencia en el desarrollo y suministro de soluciones de expansión, memoria y almacenamiento de nivel industrial en una gran variedad de sectores industriales globales. ContactosVentas: [email protected] Foto - https://mma.prnewswire.com/media/2414604/2024_05_PR_Compact_Solution_1920x1080.jpg